+
20G Soldering Tin Paste Flux No-cleaning 183 Melting Point Welding Flux For Mobile Phone BGA SMT Repair Tool
20G Soldering Tin Paste Flux No-cleaning 183 Melting Point Welding Flux For Mobile Phone BGA SMT Repair Tool
Specification: --Type : Solder Tin Paste --Gross Weight : 20g--Melting Point : 183℃--Features：No virtual welding. Less residue, strong adhesion, no cleaning--Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.Package:1 * Solder Tin Paste
Features : No virtual welding. Less residue
Function : Welding Paste
Features 1 : Strong adhesion, no cleaning
weight : 20g
Certification : NONE
Origin : CN(Origin)
Melting point : 183℃
Application : Mobile phone repair tool
Model Number : Nona-20 solder tin paste
Particle Size : 20-38μm
