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Amaoe BGA Reballing Stencil Kit for Huawei P30pro Motherboard Middle Layer Reballing Repair Tool With Magnetic Positioning Kit

USD 6.20

Amaoe BGA Reballing Stencil Kit for Huawei P30pro Motherboard Middle Layer Reballing Repair Tool With Magnetic Positioning Kit

Description

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Specification

Application : for Huawei P30pro

Certification : NONE

Origine : CN (Origine)

Numéro de Modèle : Qianli BGA

Taille des particules : 20-38 μm

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