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Amaoe Mate X2 BGA Reballing Stencil for Huawei Tablet Middle Layer 0.12MM CPU IC Chip Tin Plant Net Weld Heat Steel Mesh

USD 2.82USD 4.03

Amaoe Mate X2 BGA Reballing Stencil for Huawei Tablet Middle Layer 0.12MM CPU IC Chip Tin Plant Net Weld Heat Steel Mesh

Description

Amaoe Mate X2 BGA Reballing Stencil for Huawei Tablet Middle Layer 0.12MM CPU IC Chip Tin Plant Net Weld Heat Steel Mesh

Specification

Origin : Mainland China

Brand Name : FREE YOUNG

Pieces Included : 1

Material : Other

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