Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate40Pro 0.12MM CPU IC Chip Motherboard Solder Tin Plant Net Steel Mesh
Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate40Pro 0.12MM CPU IC Chip Motherboard Solder Tin Plant Net Steel Mesh
Origin : Mainland China
Brand Name : FREE YOUNG
Pieces Included : 1
Material : Other