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Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate40Pro 0.12MM CPU IC Chip Motherboard Solder Tin Plant Net Steel Mesh

USD 2.87USD 4.22

Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate40Pro 0.12MM CPU IC Chip Motherboard Solder Tin Plant Net Steel Mesh

Description

Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate40Pro 0.12MM CPU IC Chip Motherboard Solder Tin Plant Net Steel Mesh

Specification

Origin : Mainland China

Brand Name : FREE YOUNG

Pieces Included : 1

Material : Other

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