If you are a novice very recommended you use our test board, this can save you a lot of time!

ESP8266 selection features

Each has its own characteristics:

1, ESP-01: PCB antenna, after matching, distance to do about 400 meters open, easy to use. Link:

2, ESP-02: patch package, suitable for submission restrictions, the antenna can lead out the shell with IPX head.

3, ESP-03: patch package, built-in ceramic antenna technology, all available IO leads.

4, ESP-04: patch package, the customer can customize the antenna type, flexible design, all IO output.

5, ESP-05: patch package, only leads to serial port and RST feet, small size, the antenna can be external.

6, ESP-06: the end of the paste process, all IO port leads, with metal shield shell, can be FCC CE certification, recommended.

7, ESP-07: half hole patch technology, all IO leads, with metal shield case, FCC CE certified, external IPX antenna can also be used built-in ceramic antenna.

8, ESP-08: with ESP-07, the difference is that the antenna form customers can define their own.

9, ESP-09: ultra-small size package, only 10 * 10 mm, four-layer process! 1M bytes.

10, ESP-10: patch interface, narrow body design, 10 mm wide, suitable for light with controller

11, ESP-11: patch interface, ceramic antenna, small size.

Functional Description:

1 full IO port leads, support AT and internal ESP8266 direct development of products

2 with shielded shell, stability to improve a level

3 supports 3-way PWM 6-way IO all the way AD and one high-speed UART

4 firmware upgrade, the client (phone or PC) can directly control the PWM IO or UART no external MCU

5 This test board can be used to upgrade

This test board uses:

1 Test the stability of ESP-12.

2 as a low-cost minimum system for learning, AT commands or SDK can be downloaded to download

3 show the services provided by the company: APP + server + hardware equipment all research and development strength

The company can provide a full set of APP server hardware program, so that customers take the road, used to use. Reduce development investment, as soon as possible out of the product.