Description

Busbar Wire 5mm*0.08mm 

(Used for Thin film soalr cell soldering and other clectrical soldering)

Productions Description:

Parameters:

1、Copper：Oxgen free copper; Copper content≥99.97%

2、Copper base resistivity：Oxgen free copper≤0.01724Ωmm2/m

3、Coating Comosition ：60%Sn 40%Pb

4、Solder melting point：179-224℃

5、Coating tickness：0.01～0.04mm (Can be customized according to customer requirements),Double coating ;Uniform

6、Solder Tape elongation：Soft state ≥25%，Semi soft state≥15%

7、Width error：±0.05mm  Thickness error：±0.005mm